Maximum Performance Under Extreme Conditions
Power electronics are the backbone of modern energy converters, e-mobility, and industrial applications. Miniaturization and high performance require absolute reliability of every material connection—from the contact surface to the final encapsulation. Voids, oxides, and material mismatches become critical risk factors.
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Power modules—the heart of modern power electronics
Power modules are the backbone of modern electronic power conversion across e-mobility, industrial applications, and renewable energy systems. They handle extreme currents while demanding maximum miniaturization and sophisticated thermal management. With the use of advanced materials such as SiC and MOSFET technologies, designs are becoming ever more compact and efficient.
However, this technological progress also introduces significant challenges. Voids and oxide layers can severely reduce performance and shorten service life. The ongoing trend toward miniaturization requires utmost precision, as even the smallest inaccuracies can have a measurable impact. At the same time, thermal stress, complex material transitions, and continuous vibration place additional strain on the components. Together, these factors increase the risk of failures, delamination, and customer complaints — ultimately threatening both product reputation and warranty reliability.
Our solution for typical power pain points
Extreme demands on materials and connections
High-performance power modules must deliver reliable operation for years under extreme conditions—in electric vehicles, wind turbines, or industrial drives. High temperatures, voltages, and mechanical stresses coincide with increasingly compact designs. A major challenge arises at so-called “triple points,” where materials like copper, ceramics, and potting compounds meet. These zones are prone to stress, voids, and adhesion issues that can drastically reduce service life. Oxidized metal surfaces further impair solderability and raise contact resistance, while overmolding increases the risk of epoxy delamination.
The solution lies in reliable interconnect technologies and precise surface treatment to ensure long-term stability.
Comparison with competitive processes—Why Plasmatreat is superior
Other cleaning processes such as wet chemistry, vacuum procedures, or mechanical methods face key limitations. Wet chemical cleaning removes thick oxide layers but needs chemicals, complex rinsing steps, and causes environmental pollution. Vacuum processes are mostly batch operations, use a lot of energy, and are difficult to automate. Mechanical techniques like brushing risk leaving particles and aren't reliable for inline quality.
Plasmatreat sets new standards: Openair-Plasma® and REDOX® tools deliver fully automated, physical, chemical-free cleaning in-line that outperforms conventional processes. These methods reliably remove even tough oxide layers, prepare large or complex parts, and, with PlasmaPlus®, form a protective nano-barrier against moisture, migration, and aging.
Plasmatreat offers maximum process integration, scalability, and sustainability—without compromise.
Strong Partners – Strong Solutions
Our technology is used worldwide in cooperation with leading manufacturers
At its booth, Plasmatreat will demonstrate the precise movement of wafers between two plasma process stations using Beckhoff's contactless XPlanar transport system. More automation solutions can be found at Beckhoff Automation in hall A2, booth 331.
At RAMPF, booth 335 in hall A3 you can see how plasma technology is integrated into the compact MC 1000 automation solution, alongside dispensing, joining and testing technology.
In Hall 7 at Booth 169 You Will Get Exciting Insights
Our solution: Precise surface treatment for reliable power modules
Plasmatreat’s Openair-Plasma® technology and the REDOX®-Tool provide advanced inline cleaning and oxide reduction that ensure optimal adhesion and reliable performance—even for demanding applications.
Oxide layers and weak adhesion are thoroughly eliminated, resulting in clean, defect-free surfaces.This leads to improved conductivity for power modules and semiconductors, higher yield rates, and less rework due to consistently clean processes. Durable adhesion and material compatibility maximize product reliability and service life, especially under tough conditions. With Plasmatreat, manufacturers can count on best-in-class results for next-generation high-performance electronics—delivering superior electrical properties and long-lasting quality.
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