Increased Yield in Electronics Manufacturing with Openair-Plasma^®

Openair-Plasma^® is the core technology behind Plasmatreat’s surface treatment solutions for modern electronics production. Unlike conventional low-pressure plasma systems that rely on vacuum chambers and batch operation, Openair-Plasma^® works under normal atmospheric conditions and can be seamlessly integrated into continuous production lines. This enables high-throughput, inline processes without interrupting the manufacturing flow.

The process is potential-free, making it safe for delicate electronic components. It uses standard industrial gases such as compressed air or nitrogen—no costly specialty gases are required. Combined with Plasmatreat’s PCU (Process Control Unit) for real-time monitoring, Openair-Plasma^® ensures stable parameters, reproducible results, and traceable process quality.

During semiconductor manufacturing, leadframes are cleaned and reduced to remove organic contaminants, flux residues, and inorganic oxides. This is essential to ensure reliable electrical and mechanical connections in subsequent processes such as wire bonding, die bonding, and encapsulation.

The REDOX^®-Tool from Plasmatreat provides a dry, inline oxide reduction process under atmospheric conditions—without solvents, vacuum chambers, or post-washing steps. Unlike wet-chemical cleaning methods that require rinsing, drying, and chemical waste handling, the REDOX^® process uses plasma-assisted reduction to remove oxide layers and prepare metal surfaces for high-yield production. With its continuous tunnel design, reproducible process control, and full integration into automated manufacturing lines, the REDOX^®-Tool ensures clean, activated surfaces that deliver consistent bondability, electrical reliability, and long-term product stability.