Increased yield in electronics manufacturing with Openair-Plasma®
Openair Plasma® from Plasmatreat is an innovative pretreatment technology for reproducible, cleanroom-friendly surface properties in electronics manufacturing. It specifically increases surface energy, removes organic and inorganic residues without chemicals, and can be safely integrated inline. This creates stable conditions for bonding, coating, and packaging with high yield and process reliability.
Would you like to learn more?
Book a Meeting and Your Free Trade Fair Ticket here*
* Please note: We provide the ticket code only to official company email addresses. Private email addresses cannot be considered. Thank you for your understanding.
Potential-free treatment on metals and polymers
Surface energy above 72 mN/m for stable adhesion
Low-particle, dry processes for clean rooms
Reduction of chemicals and operating resources
Inline-capable and reproducible in cycle time
Efficient and sustainable with air, nitrogen, or water
Achieve purity and adhesion targets reliably: potential-free treatment, low-particle processes, and inline-compatible systems for sensitive electronic surfaces
Miniaturization and increasing power densities require absolutely clean, oxide-free, and easily wettable surfaces. With Openair Plasma®, you can treat sensitive substrates potential-free and low-particle, locally precise or homogeneously over a large area, directly inline. Experience the processes live in Munich and test your components at the booth.
Would you like to test plasma for your component?
Solution Components
PFA10
Local, low-particle, and potential-free plasma treatment. Removes organic residues and oxide layers, activates surfaces for hybrid bonding and chiplet stacking.
PDB-100 (DBD)
Flat, atmospheric treatment with 100 mm effective width. Uniform activation of wafers and tape frames with low thermal stress.
REDOX® Tool
Inline oxide reduction on metal surfaces without formic acid. Cycle time-compatible for lead frames and power modules, dry and reproducible.
PlasmaPlus® Nanocoating
Functional nanolayers for adhesion and barrier. Supports overmolding, sintering, and bonding, helps prevent delamination at EMC, enables targets up to MSL 1. Optional AntiCorr®.
HydroPlasma® Flux Removal
Removes flux residues without solvents using water, compressed air, and electricity. Basis for fluxless TCB and clean PCB assemblies.
Atmospheric Plasma in Electronics Manufacturing
Openair-Plasma® is the core technology behind Plasmatreat’s surface treatment solutions for modern electronics production. Unlike conventional low-pressure plasma systems that rely on vacuum chambers and batch operation, Openair-Plasma® works under normal atmospheric conditions and can be seamlessly integrated into continuous production lines. This enables high-throughput, inline processes without interrupting the manufacturing flow.
The process is potential-free, making it safe for delicate electronic components. It uses standard industrial gases such as compressed air or nitrogen—no costly specialty gases are required. Combined with Plasmatreat’s PCU (Process Control Unit) for real-time monitoring, Openair-Plasma® ensures stable parameters, reproducible results, and traceable process quality.
With its flexibility, reliability, and cost-efficiency, Openair-Plasma® provides the foundation for HydroPlasma® and REDOX®, setting a new standard for atmospheric plasma integration in advanced electronics manufacturing.
CTA:
→ See Openair-Plasma® in action at Productronica
→ Book your appointment with our plasma experts
BRANDNEW! Flux Removal for the Next Generation of Miniaturized Electronics
As electronic assemblies become increasingly compact, even minimal flux residues can compromise reliability through corrosion, leakage currents, or bonding defects. With our new HydroPlasma® technology, Plasmatreat offers a dry, inline, and potential-free flux removal process that operates under atmospheric conditions – without solvents, vacuum chambers, or any need for post-washing.
Unlike conventional low-pressure plasma systems that require vacuum environments and batch operation, Openair-Plasma® enables continuous, high-throughput processing directly in the production line. The result is perfectly clean PCB surfaces, even between fine-pitch components and under low standoffs – ideal for miniaturized and high-density electronic assemblies.
HydroPlasma® combines process stability, reproducibility, and full compatibility with cleanroom standards, delivering superior performance and maximum quality in advanced electronics manufacturing.
During semiconductor manufacturing, leadframes are cleaned and reduced to remove organic contaminants, flux residues, and inorganic oxides. This is essential to ensure reliable electrical and mechanical connections in subsequent processes such as wire bonding, die bonding, and encapsulation.
The REDOX® tool from Plasmatreat provides a dry, inline oxide reduction process under atmospheric conditions – without solvents, vacuum chambers, or post-washing steps. Unlike wet-chemical cleaning methods that require rinsing, drying, and chemical waste handling, the REDOX® process uses plasma-assisted reduction to remove oxide layers and prepare metal surfaces for high-yield production.
With its continuous tunnel design, reproducible process control, and full integration into automated manufacturing lines, REDOX® ensures clean, activated surfaces that deliver consistent bondability, electrical reliability, and long-term product stability.
CTA:
→ Experience REDOX® live at Productronica
→ Talk to our application engineers on-site
See What Plasma Can Do for Your Own Process
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Visit Plasmatreat in hall A2 at booth 445!
See. Feel. Understand. Plasma live!
* Please note: We provide the ticket code only to official company email addresses. Private email addresses cannot be considered. Thank you for your understanding.
Watch Plasma Technology Firsthand. Its Various Applications Offer Countless Possibilities.
At the Plasmatreat booth, technology becomes an experience.
Various exhibits and areas demonstrate how atmospheric pressure plasma can transform your production processes.
Book a Consultation and Your Free-ticket Here*
* Please note: We provide the ticket code only to official company email addresses. Private email addresses cannot be considered. Thank you for your understanding.
In Hall A2 at Booth 445 You Will Get Exciting Insights
Participate Now and Visit Plasmatreat at Booth 445, in Hall A2 for Your Chance to Win. We are giving away one grand prize and six additional prizes to all participants.
1st Prize:
An Exclusive Material Test
Experience our technology up close. See firsthand how our surface treatment can make your production more sustainable, efficient, and economical.
- Send in your material
- Spend a day in our application technology department
- Test your components with Openair-Plasma®, PlasmaPlus®, or HydroPlasma®
2nd-7th Prize:
A Three-pack of Smart Golf Balls Pack Or a Plasma-treated and Personalized Printed Power Bank
Win three trackable golf balls — for less plastic waste and more golfing fun! With the kind support of our partner Chip-Ing Ltd.
Or keep you and your electronic devices ready for action with your new personalized power bank.
- Track you golf ball via app and view performance data
- Play longer and more sustainably
Can't Make It To The Trade Fair?
No problem! You can still secure your chance to win. We are giving away three additional trackable golf balls to all online participants.
Simply fill out the contact form to be automatically entered into the prize drawing.
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