Offcanvas Navigation
Perfect Surfaces for Reliable Power Electronics
Plasma-based surface treatment for power electronics—meet Plasmatreat at PCIM in Nuremberg: Hall 7, Booth 169
Power electronics is the key technology for power supply, electric mobility, energy storage, renewable energy, and industrial applications. Reliable material bonds throughout the entire process and the entire product life are indispensable due to high power densities and increasing miniaturization. Oxides, voids, delamination, and material incompatibilities pose significant risks to quality and reliability.
Would you like to learn more?
Book a Meeting and Your Free Trade Fair Ticket here*
* Please note: Ticket codes are sent only to official company email addresses.
Why Use Plasma in Power Module Manufacturing?
In power module manufacturing, long-term reliability depends on perfectly prepared surfaces at every step of the process. Plasma technology enables precise surface preparation by removing oxides and residual contaminants while cleaning and activating materials for subsequent processes, such as coating, molding or potting, bonding or applying thermal interface materials (TIM). The result is improved adhesion, reduced risk of delamination, and consistently stable interfaces—all of which are essential prerequisites for robust, high-performance power modules.
Plasma treatment is also a reproducible process that can be performed in cleanroom environments and integrated into production lines, helping manufacturers meet the growing demands for miniaturization, power density, and thermal performance.
Higher Yield Through Stable and Reproducible Plasma Processes
Plasmatreat's Openair-Plasma® (atmospheric pressure) and AURORA-Plasma (low-pressure plasma) ,technologies cover the entire range of solutions, including the removal of oxides and flux, improving adhesion, preventing EMC delamination, and optimizing surface preparation for TIMs.
Would you like to learn more right away?
Exciting Insights and Live Demos at PCIM—Hall 7, Booth 169
Low Pressure Plasma with AURORA
In power module manufacturing, complex geometries, enclosed structures, and sensitive materials often limited processes. Low‑pressure plasma enables uniform, reproducible surface modification across the entire component. With the new AURORA-Plasma system, Plasmatreat introduces a multifrequency approach that allows plasma processes to be precisely tailored—from gentle surface activation to intensive oxide and residue removal or plasma etching. This makes AURORA-Plasma the ideal add-on in the Plasmatreat product portfolio.
Your Benefits of AURORA-Plasma
- Uniform treatment of complex and enclosed structures
- Multifrequency plasma (GHz, MHz, kHz) for exact process tuning
- Material‑gentle and highly effective cleaning and activation
- Expanded process window for industrial power module application
- Clear complement to Openair‑Plasma® for vacuum‑based requirements
Reliable Oxide Removal with REDOX®-Tool
Oxidation on copper and other metal surfaces poses a significant challenge in the manufacturing of power modules, particularly before bonding, coating, molding or potting. Oxide layers can reduce adhesion, increase electrical resistance, and compromise long-term reliability of end products. The REDOX®-Tool provides targeted, in-line plasma treatment that can remove surface oxides directly within the production process. This creates consistent surfaces that are stable for subsequent process steps.
Your Benefits of the REDOX®-Tool:
- Targeted, full-surface or selective oxide reduction on copper and metallic surfaces
- Inline-capable Openair-Plasma® solution for high-volume production
- Improved adhesion and electrical reliability in downstream processes
- Reduced scrap and rework through stable, reproducible surface conditions
- Ideal preparation for coating, bonding, molding or potting steps
Book a Meeting and Your Free Trade Fair Ticket here*
* Please note: Ticket codes are sent only to official company email addresses.
Preventing EMC Delamination with PT-Bond
Delamination of epoxy molding compounds (EMC) is a common failure risk in power module manufacturing, especially when insufficient adhesion occurs at critical interfaces. With PT‑Bond, Plasmatreat offers an environmentally friendly plasma‑polymer coating that acts as a highly effective adhesion promoter before molding. Applied directly in the plasma process, PT‑Bond creates a stable interlayer that significantly improves bonding between substrates and EMC, supporting long‑term mechanical stability and reliability.
Your Advantages of PT‑Bond
- Effective prevention of EMC delamination
- Environmentally friendly, solvent‑free adhesion promoter
- Plasma‑applied functional coating without wet chemistry
- Selective or full‑surface treatment of functional areas
- Improved process reliability and yield in molding processes
- Inline‑capable solution for industrial power module production
Flux or Epoxy Removal with HydroPlasma®
Flux residues and epoxy resin contaminants compromise the reliability of the manufacturing process of semiconductors, chips, power modules, and printed circuit boards. Such residues can impair electrical performance, reduce adhesion, and compromise long-term quality. HydroPlasma® combines plasma with reactive water‑based species to enable highly effective, material‑gentle removal of flux and organic residues—even on sensitive electronic components. The process delivers clean, activated surfaces without aggressive chemicals or mechanical stress.
Your Benefits of HydroPlasma®
- Effective removal of flux and epoxy residues
- Material‑gentle cleaning for semiconductors, chips, modules, and PCBs
- Improved electrical reliability and adhesion in downstream processes
- Chemical‑free and environmentally friendly surface treatment
- Suitable for sensitive and complex electronic assemblies
Book a Meeting and Your Free Trade Fair Ticket here*
* Please note: Ticket codes are sent only to official company email addresses.
Efficient Flux Removal on PCBs
HydroPlasma® in Action for Clean Surface and Long-Lasting Connections
Get More Insights
With our extensive product portfolio with Openair-Plasma®, AURORA-Plasma and PlasmaPlus®, we can offer our customers exactly the solution they need for their particular process and production environment."
Our solution: Precise Surface Treatment for Reliable Power Modules
Plasmatreat’s Openair-Plasma® and AURORA-Plasma technologies, along with the REDOX® tool and HydroPlasma®, offer advanced surface modification that ensures optimal adhesion and reliable performance—even in demanding applications..
Oxide layers and weak adhesion are thoroughly eliminated, resulting in clean, defect-free surfaces.This leads to improved conductivity for power modules and semiconductors, higher yield rates, and less rework due to consistently clean processes. Durable adhesion and material compatibility maximize product reliability and service life, especially under tough conditions. With Plasmatreat, manufacturers can count on best-in-class results for next-generation high-performance electronics—delivering superior electrical properties and long-lasting quality.
Watch Plasma Technology Firsthand. Its Various Applications Offer Countless Possibilities.
At the Plasmatreat booth, technology becomes an experience.
Various exhibits and areas demonstrate how atmospheric pressure plasma and low-pressure plasma can transform your production processes.
Hall 7, Booth 169 is the place to be to learn more about plasma technology.
Book a Meeting and Your Free Trade Fair Ticket here*
* Please note: Ticket codes are sent only to official company email addresses.
The Plasmatreat experts are happy to meet you and discuss your challenges in power module manufacturing with you.
Nous sommes à votre disposition dans le monde entier :
