Perfect Surface Treatment Processes for Reliable Power Electronics

In power module manufacturing, complex geometries, enclosed structures, and sensitive materials often limited processes. Low‑pressure plasma enables uniform, reproducible surface modification across the entire component. With the new AURORA-Plasma system, Plasmatreat introduces a multifrequency approach that allows plasma processes to be precisely tailored—from gentle surface activation to intensive oxide and residue removal or plasma etching. This makes low‑pressure plasma the ideal add-on in the Plasmatreat product portfolio. 

Your Benefits of AURORA-Plasma

• Uniform treatment of complex and enclosed structures
• Multifrequency plasma (GHz, MHz, kHz) for exact process tuning
• Material‑gentle and highly effective cleaning and activation
• Expanded process window for industrial power module application
• Clear complement to Openair‑Plasma^® for vacuum‑based requirements

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Oxidation on copper and other metal surfaces poses a significant challenge in the manufacturing of power modules, particularly before bonding, coating, or molding. Uncontrolled oxide layers can reduce adhesion, increase electrical resistance, and compromise long-term reliability. The REDOX^®-Tool provides targeted, in-line plasma treatment that can reduce and stabilize surface oxides directly within the production process. This creates consistent surfaces that are stable for subsequent assembly steps.
 

headline 3: Advantages of the REDOX^®-Tool:

• Targeted oxide reduction on copper and metallic surfaces
• Inline-capable Openair-Plasma^® solution for high-volume production
• Improved adhesion and electrical reliability in downstream processes
• Reduced scrap and rework through stable, reproducible surface conditions
• Ideal preparation for coating, bonding, and molding steps in power modules

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Delamination of epoxy molding compounds (EMC) is a common failure risk in power module manufacturing, especially when insufficient adhesion occurs at critical interfaces. With PT‑Bond, Plasmatreat offers an environmentally friendly plasma‑polymer coating that acts as a highly effective adhesion promoter before molding. Applied directly in the plasma process, PT‑Bond creates a stable interlayer that significantly improves bonding between substrates and EMC, supporting long‑term mechanical stability and reliability.

Your Advantages of PT‑Bond Coating

• Effective prevention of EMC delamination
• Environmentally friendly, solvent‑free adhesion promoter
• Plasma‑applied functional coating without wet chemistry
• Selective or full‑surface treatment of functional areas
• Improved process reliability and yield in molding processes
• Inline‑capable solution for industrial power module production

Residual fluxes and epoxy contamination are a major challenge in the manufacturing of semiconductors, chips, power modules, and PCBs. Such residues can impair electrical performance, reduce adhesion, and compromise long‑term reliability. HydroPlasma^® combines plasma with reactive water‑based species to enable highly effective, material‑gentle removal of flux and organic residues—even on sensitive electronic components. The process delivers clean, activated surfaces without aggressive chemicals or mechanical stress.

Your Advantages of HydroPlasma^®

• Effective removal of flux and epoxy residues
• Material‑gentle cleaning for semiconductors, chips, modules, and PCBs
• Improved electrical reliability and adhesion in downstream processes
• Chemical‑free and environmentally friendly surface treatment
• Suitable for sensitive and complex electronic assemblies

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_{* Please note: Ticket codes are sent only to official company email addresses.}