Achieve purity and adhesion targets reliably with Openair-Plasma®
Openair-Plasma® from Plasmatreat is an innovative pretreatment technology for reproducible, cleanroom-compatible surface properties in electronics manufacturing. It enables potential-free plasma treatment, low-particle processes, and inline integration for sensitive electronic surfaces.
Miniaturized and high-performance electronic components require absolutely clean, oxide-free, and highly wettable surfaces to ensure reliability and yield.
Would you like to learn more?
Book a Meeting and Your Free Trade Fair Ticket here*
* Please note: Ticket codes are sent only to official company email addresses.
Performance and Reliability Through Atmospheric Plasma
Potential-free treatment for delicate and conductive materials
Protects sensitive structures and interconnects while preparing surfaces for hybrid bonding and chiplet stacking.
Low-particle and dry process for cleanroom integration
No solvents, no rinsing, no residues—ideal for contamination-sensitive environments.
Inline compatible from local to 100 mm
Scales from precise spot to homogeneous 100 mm surface treatment for up to 300 mm wafer.
Atmospheric oxide reduction with forming gas
Removes thin oxide layers using PFA10 (local) and PBD100 (large-area) for bonding and coating readiness.
No argon specialty gas; controlled N₂/H₂
Uses forming-gas concepts instead of argon, avoids ozone formation and maintains a stable process environment.
Process control with PCU for traceability
Monitors plasma parameters in real time to ensure reproducibility and documented quality.
Atmospheric Plasma for Oxide Reduction in Semiconductor Manufacturing
Openair-Plasma® enables efficient and reproducible oxide reduction under atmospheric conditions. Using forming gas in combination with our PFA10 and PBD100 plasma jets, the process removes thin oxide layers and prepares metal surfaces for reliable bonding, coating, and packaging steps.
With Openair-Plasma®, you can treat sensitive substrates potential-free and low-particle—either locally precise or homogeneously across large areas—directly inline.
Experience the process live in Munich and test your components at our booth.
Would you like to test plasma for your component?
Solution Components
PFA10
Local, low-particle, and potential-free plasma treatment. Removes organic residues and oxide layers, activates surfaces for hybrid bonding and chiplet stacking.
PBD100
Flat, atmospheric treatment with 100 mm effective width. Uniform activation of wafers and tape frames with low thermal stress.
REDOX® Tool
Inline oxide reduction on metal surfaces without formic acid. Cycle time-compatible for lead frames and power modules, dry and reproducible.
Atmospheric Plasma in Electronics Manufacturing
Openair-Plasma® is the core technology behind Plasmatreat’s surface treatment solutions for modern electronics production. Unlike conventional low-pressure plasma systems that rely on vacuum chambers and batch operation, Openair-Plasma® works under normal atmospheric conditions and can be seamlessly integrated into continuous production lines. This enables high-throughput inline processes without interrupting the manufacturing flow.
The process is potential-free, making it safe for delicate electronic components. It uses standard industrial gases such as compressed air or nitrogen, with no costly specialty gases required. Combined with Plasmatreat’s PCU (Process Control Unit) for real-time monitoring, Openair-Plasma® ensures stable parameters, reproducible results and traceable process quality. With its flexibility, reliability and cost efficiency, Openair-Plasma® provides the foundation for HydroPlasma® and REDOX®, setting a new standard for atmospheric plasma integration in advanced electronics manufacturing.
BRANDNEW! Efficient Oxide Reduction for Reliable Semiconductor Processes
As semiconductor devices become smaller and more powerful, even thin oxide layers can affect bonding quality and electrical performance. With Openair-Plasma® technology, Plasmatreat offers a dry, inline and potential-free oxide reduction process that runs under atmospheric conditions. It works without solvents, vacuum chambers or wet-chemical steps. Using forming gas together with our PFA10 and PBD100 plasma jets, metal surfaces are precisely cleaned and reduced for reliable bonding, coating and packaging.
Unlike conventional plasma systems that rely on argon or pure hydrogen, Openair-Plasma® uses forming gas based on nitrogen and hydrogen in controlled concentrations. This prevents ozone formation and ensures a stable, safe and clean process environment, ideally suited for cleanroom applications. Openair-Plasma® combines process stability, reproducibility and full inline compatibility. It delivers high-purity, low-particle surfaces for next-generation semiconductor manufacturing.
REDOX®—Inline Oxide Reduction for Reliable Leadframe Assembly
During semiconductor manufacturing, leadframes are cleaned and reduced to remove organic contaminants, flux residues and inorganic oxides. This is essential to ensure reliable electrical and mechanical connections in subsequent processes such as wire bonding, die bonding and encapsulation.
The REDOX® tool from Plasmatreat provides a dry, inline oxide reduction process under atmospheric conditions without solvents, vacuum chambers or post-washing steps. Unlike wet-chemical cleaning methods that require rinsing, drying and chemical waste handling, the REDOX® process uses plasma-assisted reduction to remove oxide layers and prepare metal surfaces for high-yield production. With its continuous tunnel design, reproducible process control and full integration into automated manufacturing lines, REDOX® ensures clean, activated surfaces that deliver consistent bondability, electrical reliability and long-term product stability.
See What Plasma Can Do for Your Own Process
Experience the potential of atmospheric plasma directly at our booth. Bring your components and test them live with our experts.
Visit Plasmatreat in hall B1 at booth 136!
See. Feel. Understand. Plasma live!
* Please note: Ticket codes are sent only to official company email addresses.
In Hall B1 at Booth 136 You Will Get Exciting Insights
Participate Now and Visit Plasmatreat at Booth 136, in Hall B1 for Your Chance to Win. We are giving away one grand prize and six additional prizes to all participants.
1st Prize:
An Exclusive Material Test
Experience our technology up close. See firsthand how our surface treatment can make your production more sustainable, efficient, and economical.
- Send in your material
- Spend a day in our application technology department
- Test your components with Openair-Plasma®, PlasmaPlus®, or HydroPlasma®
2nd-7th Prize:
A Three-pack of Smart Golf Balls Pack Or a Plasma-treated and Personalized Printed Power Bank
Win three trackable golf balls—for less plastic waste and more golfing fun! With the kind support of our partner Chip-Ing Ltd.
Or keep you and your electronic devices ready for action with your new personalized power bank.
- Track you golf ball via app and view performance data
- Play longer and more sustainably
Can't Make It To The Trade Fair?
No problem! You can still secure your chance to win. We are giving away three additional trackable golf balls to all online participants.
Simply fill out the contact form to be automatically entered into the prize drawing.
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